Embedded probe-enabling socket with integral probe structures

Details Embedded probe-enabling socket with integral probe structures Embedded probe-enabling socket with integral probe structures

2007-04-10

2007-04-10

Nguyen, Vinh (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S754090, C165S080300

Reexamination Certificate

active

11290876

ABSTRACT:
A method of testing and an embedded probe-enabling socket are provided for implementing debug and testing functions. The socket includes an integral probe structure enabling Top Side of the Module (TSM) signal probing. The socket includes a substrate with a topside including a plurality of probe pads. A TSM socket frame includes a plurality of probe pins electrically connecting to respective probe pads on the substrate topside. The probe pins are electrically connected with a respective signal to be monitored.

REFERENCES:
patent: 6396698 (2002-05-01), Holcombe
patent: 6636061 (2003-10-01), Crook et al.
patent: 6667631 (2003-12-01), Ivanov
patent: 6812485 (2004-11-01), Shah et al.
patent: 2004/0257103 (2004-12-01), Park et al.

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