Embedded phase-change memory and method of fabricating the same

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component

Reexamination Certificate

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C438S145000, C438S169000, C438S170000, C438S188000, C438S189000, C438S197000, C438S200000, C438S234000, C438S666000, C438S947000, C257S002000, C257S005000, C257S295000, C257S298000, C257S529000, C257S536000, C257S537000, C257SE27004, C257SE31029, C257SE45002

Reexamination Certificate

active

08071396

ABSTRACT:
An embedded memory required for a high performance, multifunction SOC, and a method of fabricating the same are provided. The memory includes a bipolar transistor, a phase-change memory device and a MOS transistor, adjacent and electrically connected, on a substrate. The bipolar transistor includes a base composed of SiGe disposed on a collector. The phase-change memory device has a phase-change material layer which is changed from an amorphous state to a crystalline state by a current, and a heating layer composed of SiGe that contacts the lower surface of the phase-change material layer.

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