Embedded package structure module with high-density...

Details Embedded package structure module with high-density... Embedded package structure module with high-density...

2008-07-03

2010-10-19

Stark, Jarrett J (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

C257S088000, C257SE33056, C438S028000

Reexamination Certificate

active

07816689

ABSTRACT:
An embedded package structure module with high-density electrical connections, including: a drive IC structure, an LED array structure and a plurality of conductive structures. The drive IC structure has at least one concave groove. The LED array structure is received in the at least one concave groove of the drive IC structure, and the LED array structure has a plurality of second open grooves formed on its lateral wall and close to the drive IC structure. The conductive structures respectively traverse the second open grooves in order to make the conductive structures electrically connect between the drive IC structure and the LED array structure.

REFERENCES:
patent: 6498356 (2002-12-01), Sekiya et al.
patent: 2003/0205806 (2003-11-01), Chang et al.
patent: 2009/0184332 (2009-07-01), Wu

Affiliated with

Also associated with

Rating

Embedded package structure module with high-density... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Embedded package structure module with high-density..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Embedded package structure module with high-density... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4214247