Embedded metal planes for thermal management

Details Embedded metal planes for thermal management Embedded metal planes for thermal management

1997-01-16

1998-08-11

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

257720, 257712, 257713, 257717, H01L 2144, H01L 2148, H01L 2150

Patent

active

057926778

ABSTRACT:
In order to dissipate heat from an electronic device, there is disclosed a method whereby with the use of metal planes embedded in an insulating substrate, heat generated by the electronic device can be transported and dissipated to a remote, more desirable location.

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patent: 5563773 (1996-10-01), Katsumata
patent: 5650662 (1997-07-01), Edwards et al.

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