Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2007-09-11
2007-09-11
Zarneke, David A. (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C257SE21510
Reexamination Certificate
active
11626918
ABSTRACT:
An embedded heat spreader includes a semiconductor die, an elastomer layer attached to the die, a tape lead attached to the elastomer, a portion of the tape lead exposed through the elastomer to connect with the die, a polymer resin attached to the tape lead, and a thermally conductive substrate attached to the polymer resin such that the thermally conductive substrate can spread heat from the semiconductor die.
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English language abstract of Japanese Publication No. 11145345, vol. 1999, No. 10 (Aug. 31, 1999).
Intel Corporation
Marger & Johnson & McCollom, P.C.
Zarneke David A.
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