Embedded heat pipe in a hybrid cooling system

Details Embedded heat pipe in a hybrid cooling system Embedded heat pipe in a hybrid cooling system

2005-12-05

2009-06-23

Gandhi, Jayprakash N (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S699000, C361S704000, C361S719000, C165S104260, C165S104330

Reexamination Certificate

active

07551442

ABSTRACT:
One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to remove heat generated by the heat-generated device, and a heat pipe disposed within the liquid channel, where the heat pipe increases the heat transfer surface area to which the heat transfer liquid is exposed. Among other things, the heat pipe advantageously increases the heat transfer surface area to which the heat transfer liquid is exposed and efficiently spreads the heat generated by the heat-generating device over that heat transfer surface area. The result is enhanced heat transfer through the liquid channel relative to prior art cooling systems.

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Translation of Office Action for related Chinese patent application citing CN 1658123A (Citation Reference B1), dated May 30, 2008. Provided is an explanation of relevance of Citation Reference B1. Citation Reference A1 (US 2005/0180106) is the U.S. equivalent of Citation Reference B1.

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