Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1993-07-15
1995-05-09
Picard, Leo P.
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174262, 174264, 174265, H05K 900
Patent
active
054142210
ABSTRACT:
A process for fabricating embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias or contacts. A conductive ground plane disposed between two dielectric layers has vias formed by removing insulating dielectric and conductive ground plane material according to a single photo-lithography masking operation. A sidewall insulator formed on vertical sidewalls of the vias, electrically isolates the ground plane from interconnect metal passing from a lower interconnect layer to an upper interconnect layer through the vias. Alternatively, shielding structures incorporating multiple sidewall insulators and upper and lower shielding may be fabricated to entirely encapsulate the lower interconnect metal from external environments. Process efficiency and yield are increased due to the simplified processing of the embedded ground plane and shielding structures. A variety of deposition methods are set forth including methods employing an anisotropic etch and methods employing an etch-stop/masking layer. Resulting structures are also described.
REFERENCES:
patent: 4023197 (1977-05-01), Magdo et al.
patent: 4628406 (1989-12-01), Smith et al.
patent: 4803450 (1989-02-01), Burgess et al.
patent: 4931411 (1990-06-01), Tigelaar et al.
patent: 5056216 (1991-10-01), Madou et al.
patent: 5079670 (1992-01-01), Tigelaar et al.
patent: 5126794 (1992-06-01), Altmann
patent: 5139971 (1992-08-01), Giridhar et al.
patent: 5165166 (1992-11-01), Carey
patent: 5210379 (1993-05-01), Okonogi et al.
patent: 5262596 (1993-11-01), Kawakami et al.
patent: 5308929 (1994-05-01), Tani et al.
Hartmut Roskos, Martin C. Nuss, Keith W. Goossen, David W. Kisker, Alice E. White, Ken T. Short, Dale C. Jacobson, & John M. Poate, "Propagation of Picosecond Electrical Pulses on a Silicon-Based Microstrip Line With Buried Cobalt Silicide Ground Plane", Appl. Phys. Lett 58(23), 10 Jun. 1991, pp. 2604-2606.
Figlin Cheryl R.
Intel Corporation
Picard Leo P.
LandOfFree
Embedded ground plane and shielding structures using sidewall in does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Embedded ground plane and shielding structures using sidewall in, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Embedded ground plane and shielding structures using sidewall in will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1707586