Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-02-08
1995-10-17
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29834, 29840, 228 563, 437 8, H05K 330
Patent
active
054578809
ABSTRACT:
Cooperative patterns are formed in stencils and/or substrates that facilitate the monitoring and control of the circuit assembly process. A pattern of successively-larger etch blocks receives a corresponding pattern of same-size solder blocks; solder reflow problems are indicated when either too many or too few etch blocks are completely covered by solder after reflow. A pattern of same-size etch blocks receives a corresponding pattern of successively-larger solder blocks; problems with solder stencil clogging are indicated when smaller ones of the etch blocks do not receive solder paste during stenciling. Finally, component beacon openings or translucent areas are made in the electronics assembly at component locations. After component placement, the board is appropriately lit, and any uncovered openings indicate missing or grossly misaligned components.
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J. Electronic Packaging and Production vol. 29 No. 1 pp. 42-44 Jan. 1989 by Von Voss et al.
Microelectronic Packaging Technology, Materials and Processes, Proc. of 2nd ASM Intr Electronic Materials & Processing Congress pp. 281-293, Apr. 24-28, 1989 Shieh (Editor), Paper by Dody.
Bloch Carl J.
McKinley Philip E.
Ranganathan Ramaswamy
Arbes Carl J.
Digital Equipment Corporation
Hudgens Ronald C.
Thompson James F.
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