Embedded electronic component structure and fabrication...

Details Embedded electronic component structure and fabrication... Embedded electronic component structure and fabrication...

2011-01-11

2011-01-11

Dinh, Tuan T (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000, C361S766000, C361S795000

Reexamination Certificate

active

07869222

ABSTRACT:
An embedded electronic component structure and a method for forming the same are provided, wherein the embedded electronic component structure comprises a lower laminating layer, a first clamping layer, a dielectric layer, a second clamping layer, an electronic component, an upper laminating later and a via interconnection. The first clamping layer is disposed on the lower laminating layer. The dielectric layer is disposed on the first clamping layer. The second clamping layer is located on the dielectric layer. The electronic component is embedded in the dielectric layer, wherein the lower surface of the electronic component contacts the first clamping layer and the upper surface thereof contacts the second clamping layer. The upper laminating layer covers the second clamping layer. The via interconnection is adjacent to the electronic component and penetrate the dielectric layer to respectively connect the first clamping layer and the second clamping layer.

REFERENCES:
patent: 7639473 (2009-12-01), Hsu et al.
patent: 7742314 (2010-06-01), Urashima et al.

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