Embedded circuit board and process thereof

Details Embedded circuit board and process thereof Embedded circuit board and process thereof

2011-04-19

2011-04-19

Norris, Jeremy C (Department: 2835)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S846000

Reexamination Certificate

active

07926172

ABSTRACT:
An embedded circuit board including a glass fiber layer, two dielectric layers, and two circuit layers is provided. The glass fiber layer has a first surface and a second surface corresponding to the first surface. The dielectric layers are disposed on the first surface and the second surface, respectively. The circuit layers are embedded in the dielectric layers above the first surface and the second surface, respectively. The outer surface of each circuit layer is coplanar with the outer surface of each dielectric layer, and a distance between the circuit layer and the glass fiber layer is greater than or equal to 3 μm. In addition, a process of the embedded circuit board is provided.

REFERENCES:
patent: 6691409 (2004-02-01), Suzuki et al.
patent: 1395463 (2003-02-01), None
patent: 1835660 (2006-09-01), None
Chinese First Examination Report of China Application No. 2007100890018, dated Aug. 21, 2009.

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