Embedded chip package

Details Embedded chip package Embedded chip package

2011-07-05

2011-07-05

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S700000, C257SE23178

Reexamination Certificate

active

07973399

ABSTRACT:
An embedded chip package includes a substrate, a semiconductor structure, an encapsulating material layer and a plurality of conductive vias. Herein the substrate includes at least a dielectric layer and at least a patterned circuit layer disposed on the dielectric layer. The semiconductor structure is disposed on the substrate and has a plurality of electrical bonding pads, and the electrical bonding pads contact the dielectric layer. The encapsulating material layer is disposed on the substrate and around the semiconductor structure. In addition, a plurality of conductive vias is disposed in the substrate to electrically connect the patterned circuit layer to the electrical bonding pads.

REFERENCES:
patent: 5241456 (1993-08-01), Marcinkiewicz et al.
patent: 5280192 (1994-01-01), Kryzaniwsky
patent: 6469374 (2002-10-01), Imoto
patent: 6759270 (2004-07-01), Infantolino et al.
patent: 6784530 (2004-08-01), Sugaya et al.
patent: 7091593 (2006-08-01), Ishimaru et al.
patent: I237883 (2005-08-01), None
Article titled “Redistributed Chip Package (RCP) Technology” authored by Freescale Semiconductor. inc. 2005.
“Office Action of counterpart Taiwan Application”, issued on Jan. 15, 2010, p. 1-p. 4.

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