Embedded capacitors and methods for their fabrication and...

Semiconductor device manufacturing: process – Making passive device

Reexamination Certificate

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C438S250000, C257S532000, C257S758000, C257S773000, C257SE21008, C361S303000

Reexamination Certificate

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11316087

ABSTRACT:
Embedded capacitors comprise a bimetal foil (500) that includes a first copper layer (205) and an aluminum layer (210) on the first copper layer. The aluminum layer has a smooth side adjacent the first copper layer and a high surface area textured side (215) opposite the first copper layer. The bimetal foil further includes an aluminum oxide layer (305) on the high surface area textured side of the aluminum layer, a conductive polymerlayer (420) on the aluminum oxide layer, and a second copper layer (535) overlying the aluminum oxide layer. The bimetal foil may be embedded in a circuit board (700) to form high value embedded capacitors.

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patent: 6540900 (2003-04-01), Kinard et al.
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patent: 2004/0256731 (2004-12-01), Mao et al.
patent: 2005/0150596 (2005-07-01), Vargo et al.
patent: 2005/0217893 (2005-10-01), Noguchi et al.
patent: 2006/0120014 (2006-06-01), Nakamura et al.

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