Embedded capacitor multi-chip modules

Details Embedded capacitor multi-chip modules Embedded capacitor multi-chip modules

2005-05-03

2005-05-03

Pham, Hoai (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S533000

Reexamination Certificate

active

06888218

ABSTRACT:
The invention provides systems and methods for interconnecting circuit devices, wherein decoupling capacitors are disposed on a substrate and an interconnect layer having a pattern of circuit connections is formed by a deposition process over the capacitors thereby embedding the decoupling capacitors within the interconnect layer. Circuit devices can be mounted to the surface of the deposited interconnect layer at locations that minimize, or substantially minimize, the interconnect length between the chip device and the decoupling capacitors for that circuit device.

REFERENCES:
patent: 4890192 (1989-12-01), Smith
patent: 5274270 (1993-12-01), Tuckerman
patent: 5841193 (1998-11-01), Eichelberger
patent: 5973910 (1999-10-01), Gardner
patent: 406295981 (1994-10-01), None

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