Elimination of pad conditioning in a chemical mechanical polishi

Details Elimination of pad conditioning in a chemical mechanical polishi Elimination of pad conditioning in a chemical mechanical polishi

1995-09-29

1997-09-30

Morgan, Eileen P.

Abrading

Abrading process

Glass or stone abrading

451285, 451287, 451288, B24B 100

Patent

active

056720955

ABSTRACT:
A method and apparatus for polishing a film formed over a semiconductor substrate. The substrate is pressed up against an abrasive pad so that the film contacts the pad. The pad has a diameter which is less than approximately two times a diameter of the substrate. While pressure is applied to the back of the substrate, the pad is rotated with respect to the wafer and an abrasive ceria slurry is introduced onto the pad to polish the film.

REFERENCES:
patent: 4910155 (1990-03-01), Cote et al.
patent: 5245796 (1993-09-01), Miller et al.
patent: 5264010 (1993-11-01), Brancaleoni

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