Elimination of edge growth in liquid phase epitaxy

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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118415, 148172, 156624, H01L 21208

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043903797

ABSTRACT:
A method of growing a semiconductor layer by liquid phase epitaxy utilizing a slide type apparatus comprising a substrate carrier having a recess for holding a substrate and a source material carrier slidably arranged over the surface of the substrate carrier and including a well around the recess, comprises the steps of filling said well with material selected from a thermally insulating material and a material which is molten at the temperature of crystal growth and then cycling the temperature of the apparatus in a manner so as to form an epitaxial layer on a substrate in the recess which layer is essentially free of excess edge growth.

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