Eliminating systematic process yield loss via precision...

Details Eliminating systematic process yield loss via precision... Eliminating systematic process yield loss via precision...

2007-05-08

2007-05-08

Tsai, H. Jey (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

C438S018000

Reexamination Certificate

active

10992982

ABSTRACT:
A method for a semiconductor process includes correlating yield loss for the performance of a processing step in a semiconductor manufacturing process with the mechanical placement of the semiconductor substrate and, based on the correlation, placing semiconductor substrates in a position with sufficient placement precision to reduce yield loss below a predetermined threshold.

REFERENCES:
patent: 5194743 (1993-03-01), Aoyama et al.
patent: 6389366 (2002-05-01), Heavlin
patent: 6629053 (2003-09-01), Mooring

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