Eliminating stiction with the use of cryogenic aerosol

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...

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134 7, 134 36, 134902, B08B 302

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060367865

ABSTRACT:
Stiction in a microstructure may be eliminated by directing a cryogenic aerosol at the portion of the microstructure subject to stiction with sufficient force so as to free the portion of the microstructure.

REFERENCES:
patent: 2699403 (1955-01-01), Courts
patent: 3676963 (1972-07-01), Rice et al.
patent: 3702519 (1972-11-01), Rice et al.
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4038786 (1977-08-01), Fong
patent: 4356084 (1982-10-01), Hatton et al.
patent: 4389820 (1983-06-01), Fong et al.
patent: 4489740 (1984-12-01), Rattan et al.
patent: 4631250 (1986-12-01), Hayashi
patent: 4655847 (1987-04-01), Ichinoseki et al.
patent: 4744181 (1988-05-01), Moore et al.
patent: 4747421 (1988-05-01), Hayashi
patent: 4768534 (1988-09-01), Anderson
patent: 4806171 (1989-02-01), Whitlock et al.
patent: 4817652 (1989-04-01), Liu et al.
patent: 4857113 (1989-08-01), Hodge
patent: 4936922 (1990-06-01), Cherry
patent: 4962776 (1990-10-01), Liu et al.
patent: 4962891 (1990-10-01), Layden
patent: 4972677 (1990-11-01), Moriya et al.
patent: 4974375 (1990-12-01), Tada et al.
patent: 4977910 (1990-12-01), Miyahara et al.
patent: 5001084 (1991-03-01), Kawai et al.
patent: 5009240 (1991-04-01), Levi
patent: 5025597 (1991-06-01), Tada et al.
patent: 5035750 (1991-07-01), Tada et al.
patent: 5062898 (1991-11-01), McDermott et al.
patent: 5094696 (1992-03-01), Orsen
patent: 5108512 (1992-04-01), Goffnet et al.
patent: 5125979 (1992-06-01), Swain et al.
patent: 5129956 (1992-07-01), Pickering et al.
patent: 5147466 (1992-09-01), Ohmori et al.
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5181985 (1993-01-01), Lampert et al.
patent: 5195548 (1993-03-01), Roger
patent: 5209028 (1993-05-01), McDermott et al.
patent: 5217925 (1993-06-01), Ogawa et al.
patent: 5258097 (1993-11-01), Mastrangelo
patent: 5259890 (1993-11-01), Goff
patent: 5288333 (1994-02-01), Tanaka et al.
patent: 5294261 (1994-03-01), McDermott et al.
patent: 5315793 (1994-05-01), Peterson et al.
patent: 5354384 (1994-10-01), Sneed et al.
patent: 5364474 (1994-11-01), Williford, Jr.
patent: 5366156 (1994-11-01), Bauer et al.
patent: 5372652 (1994-12-01), Srikrishman et al.
patent: 5377911 (1995-01-01), Bauer et al.
patent: 5378312 (1995-01-01), Gifford et al.
patent: 5456758 (1995-10-01), Menon
patent: 5486132 (1996-01-01), Cavaliere et al.
patent: 5512106 (1996-04-01), Tamai et al.
patent: 5555902 (1996-09-01), Menon
patent: 5658636 (1997-08-01), Reed et al.
patent: 5694740 (1997-12-01), Martin et al.
patent: 5766368 (1998-06-01), Bowers
patent: 5772902 (1998-06-01), Reed et al.
Cryogenic Wafer Cleaning, Micro Contamination Identification, Analysis and Control, vol. 14(10), Nov./Dec. 1996 p. 50, 52.
J. H. Lee et al., "Fabrication of Surface Micromachined Polysilicon Actuators Using Dry Release Process of HF Gas-Phase Etching", International Electron Devices Meeting, San Francisco, CA, 1996, IEDM 96-761-764.
T. A. Lober et al., "Surface-Micromachining Processes for Electrostatic Microactuator Fabrication", Solid State Sensor and Actuator Workshop, Hilton Head Island, SC Jun. 6-9, 1988, pp. 59-62.
FSI Aries.TM. Cryokinetic Cleaning Systems Brochure (Sep. 1996).

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