Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Patent
1997-06-11
2000-03-14
Stinson, Frankie L.
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
134 7, 134 36, 134902, B08B 302
Patent
active
060367865
ABSTRACT:
Stiction in a microstructure may be eliminated by directing a cryogenic aerosol at the portion of the microstructure subject to stiction with sufficient force so as to free the portion of the microstructure.
REFERENCES:
patent: 2699403 (1955-01-01), Courts
patent: 3676963 (1972-07-01), Rice et al.
patent: 3702519 (1972-11-01), Rice et al.
patent: 4027686 (1977-06-01), Shortes et al.
patent: 4038786 (1977-08-01), Fong
patent: 4356084 (1982-10-01), Hatton et al.
patent: 4389820 (1983-06-01), Fong et al.
patent: 4489740 (1984-12-01), Rattan et al.
patent: 4631250 (1986-12-01), Hayashi
patent: 4655847 (1987-04-01), Ichinoseki et al.
patent: 4744181 (1988-05-01), Moore et al.
patent: 4747421 (1988-05-01), Hayashi
patent: 4768534 (1988-09-01), Anderson
patent: 4806171 (1989-02-01), Whitlock et al.
patent: 4817652 (1989-04-01), Liu et al.
patent: 4857113 (1989-08-01), Hodge
patent: 4936922 (1990-06-01), Cherry
patent: 4962776 (1990-10-01), Liu et al.
patent: 4962891 (1990-10-01), Layden
patent: 4972677 (1990-11-01), Moriya et al.
patent: 4974375 (1990-12-01), Tada et al.
patent: 4977910 (1990-12-01), Miyahara et al.
patent: 5001084 (1991-03-01), Kawai et al.
patent: 5009240 (1991-04-01), Levi
patent: 5025597 (1991-06-01), Tada et al.
patent: 5035750 (1991-07-01), Tada et al.
patent: 5062898 (1991-11-01), McDermott et al.
patent: 5094696 (1992-03-01), Orsen
patent: 5108512 (1992-04-01), Goffnet et al.
patent: 5125979 (1992-06-01), Swain et al.
patent: 5129956 (1992-07-01), Pickering et al.
patent: 5147466 (1992-09-01), Ohmori et al.
patent: 5158100 (1992-10-01), Tanaka et al.
patent: 5181985 (1993-01-01), Lampert et al.
patent: 5195548 (1993-03-01), Roger
patent: 5209028 (1993-05-01), McDermott et al.
patent: 5217925 (1993-06-01), Ogawa et al.
patent: 5258097 (1993-11-01), Mastrangelo
patent: 5259890 (1993-11-01), Goff
patent: 5288333 (1994-02-01), Tanaka et al.
patent: 5294261 (1994-03-01), McDermott et al.
patent: 5315793 (1994-05-01), Peterson et al.
patent: 5354384 (1994-10-01), Sneed et al.
patent: 5364474 (1994-11-01), Williford, Jr.
patent: 5366156 (1994-11-01), Bauer et al.
patent: 5372652 (1994-12-01), Srikrishman et al.
patent: 5377911 (1995-01-01), Bauer et al.
patent: 5378312 (1995-01-01), Gifford et al.
patent: 5456758 (1995-10-01), Menon
patent: 5486132 (1996-01-01), Cavaliere et al.
patent: 5512106 (1996-04-01), Tamai et al.
patent: 5555902 (1996-09-01), Menon
patent: 5658636 (1997-08-01), Reed et al.
patent: 5694740 (1997-12-01), Martin et al.
patent: 5766368 (1998-06-01), Bowers
patent: 5772902 (1998-06-01), Reed et al.
Cryogenic Wafer Cleaning, Micro Contamination Identification, Analysis and Control, vol. 14(10), Nov./Dec. 1996 p. 50, 52.
J. H. Lee et al., "Fabrication of Surface Micromachined Polysilicon Actuators Using Dry Release Process of HF Gas-Phase Etching", International Electron Devices Meeting, San Francisco, CA, 1996, IEDM 96-761-764.
T. A. Lober et al., "Surface-Micromachining Processes for Electrostatic Microactuator Fabrication", Solid State Sensor and Actuator Workshop, Hilton Head Island, SC Jun. 6-9, 1988, pp. 59-62.
FSI Aries.TM. Cryokinetic Cleaning Systems Brochure (Sep. 1996).
Becker David Scott
Hanestad Ronald J.
Thomes Gregory P.
Weygand James F.
Zimmerman Larry D.
FSI International Inc.
Stinson Frankie L.
LandOfFree
Eliminating stiction with the use of cryogenic aerosol does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Eliminating stiction with the use of cryogenic aerosol, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Eliminating stiction with the use of cryogenic aerosol will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-165163