Elevated thin film for ceramic materials

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole

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216 52, 216 19, 216 20, 216 65, 216 48, 216 49, 216 76, 216 80, B44C 122, C03C 1500

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054663318

ABSTRACT:
A novel reticulated array comprises islands of ceramic (e.g. BST 20) which are fabricated from novel materials using unique methods of patterning. Trenches (22) are formed in the ceramic substrate from the front side and filled with a filler material (e.g. parylene 24). An elevation layer (e.g. polyimide 26) is deposited above the filler material, and a front side optical coating (e.g. transparent metal layer 34, transparent organic layer 36 and conductive metallic layer 38 ) is elevated above the substrate between the ceramic islands. The elevation layer provides added protection to the optical coating during filler material removal. The substrate is thinned from the back side down through a portion of the trench filler material. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 62) containing a massive array of sensing circuits.

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