Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1994-04-04
1995-11-14
Powell, William
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
216 52, 216 19, 216 20, 216 65, 216 48, 216 49, 216 76, 216 80, B44C 122, C03C 1500
Patent
active
054663318
ABSTRACT:
A novel reticulated array comprises islands of ceramic (e.g. BST 20) which are fabricated from novel materials using unique methods of patterning. Trenches (22) are formed in the ceramic substrate from the front side and filled with a filler material (e.g. parylene 24). An elevation layer (e.g. polyimide 26) is deposited above the filler material, and a front side optical coating (e.g. transparent metal layer 34, transparent organic layer 36 and conductive metallic layer 38 ) is elevated above the substrate between the ceramic islands. The elevation layer provides added protection to the optical coating during filler material removal. The substrate is thinned from the back side down through a portion of the trench filler material. Novel fabrication methods also provide for the convenient electrical and mechanical bonding of each of the massive number of ceramic islands to a signal processor substrate (e.g. Si 62) containing a massive array of sensing circuits.
REFERENCES:
patent: 4080532 (1978-03-01), Hopper
patent: 4593456 (1986-06-01), Cheung
patent: 4740700 (1988-04-01), Shaham et al.
patent: 4745278 (1988-05-01), Hanson
patent: 4792681 (1988-12-01), Hanson
patent: 4927771 (1990-05-01), Ferrett
D. J. Warner, D. J. Pedder, J. S. Moody, and J. Burrage, "The Preparation and Performance of Reticulated Targets for the Pyroelectric Vidicon", Ferroelectrics, 33, 981, pp. 249-253.
R. Watton, F. Ainger, S. Porter, D. Pedder and J. Gooding, "Technologies and Performance for Linear and Two Dimensional Pyroelectric Arrays", SPIE vol. 510, Infrared Technology X, 1984, pp. 139-149.
T. D. Flaim, G. A. Barner, and T. Brewer, "A Novel Release Layer syster for IC Processing", Brewer Science, Inc. Rolla, Missouri, presented at KTI IF Conference, Nov., 1989.
C. Hanson, H. Beratan, R. Owen, and K. Sweetser, "Low-Cost Uncooled Focal Plane Array Technology", Texas Instruments Incorporated, DSEG, presented at IRIS Specialty Group on Infrared Detectors, Bedford, Mass., Jul. 1993.
C. Hansen, "Uncooled Thermal Imaging at Texas Instruments", SPIE 1993, International Symposium on Optics, Imaging and Instrumentation, Infared Technology, XIX, San Diego, Jul. 14, 1993.
H. Kaufman, R. Robinson, W. Hughes, "Characteristics, Capabilities, and Applications of Broad-Beam Sources", Commonwealth Scientific Corporation, Alexandria, Virginia, 1987.
R. Watton, "Ferroelectrics for Infrared Detection and Imaging", ISAF '86, Proceedings of the Sixth IEEE International Symposium on Applications of Ferroelectrics, Jun. 1986.
Carlson Brian A.
Donaldson Richard L.
Kesterson James C.
Powell William
Texas Instruments Incorporated
LandOfFree
Elevated thin film for ceramic materials does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Elevated thin film for ceramic materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elevated thin film for ceramic materials will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1218363