Elevated image sensor array which includes isolation between the

Details Elevated image sensor array which includes isolation between the Elevated image sensor array which includes isolation between the

1998-11-18

1999-08-10

Abraham, Fetsum

Active solid-state devices (e.g., transistors, solid-state diode

Non-single crystal, or recrystallized, semiconductor...

Amorphous semiconductor material

257 72, 257 88, 257184, 257226, 257233, 257234, 257290, 257291, 257292, 257293, H01L 3120

Patent

active

059362618

ABSTRACT:
An image sensor. The image sensor array includes a substrate. An interconnect structure is formed adjacent to the substrate. A plurality of image sensors are formed adjacent to the interconnect structure. Each image sensor includes a pixel electrode, and a separate I-layer section formed adjacent to the pixel electrode. The image sensor array further includes an insulating material between each image sensor. A transparent electrode is formed over the image sensors. An inner surface of the transparent electrode is electrically connected to an outer surface of the image sensors and the interconnect.

REFERENCES:
patent: 5213984 (1993-05-01), Okada et al.
Silicon Vision GmbH13 TFA Technology--a-Si:H Photodetectors, pp. 1-6, GIF image 761.times.413 pixels; Thin Film Technology pp. 1-2, GIF image 901.times.457 pixels; Archive-Index, p. 1.
Q. Zhu, T. Lule, H. Stiebig, T. Martin, J. Giehl, J. Zhou, H. Fisher, M. Bohm--Universtat-GH Siegen, Institut fur Halbleiterelektronik (IHE), D-57068, Siegen, Germany; pp. 727-729.

Affiliated with

Also associated with

Rating

Elevated image sensor array which includes isolation between the does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Elevated image sensor array which includes isolation between the, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elevated image sensor array which includes isolation between the will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1122376