Eletronic endoscope with an imaging device having side bonding p

Details Eletronic endoscope with an imaging device having side bonding p Eletronic endoscope with an imaging device having side bonding p

1987-08-10

1988-11-22

Groody, James J.

Facsimile and static presentation processing

Static presentation processing

Attribute control

35821311, 128 4, 357 80, H04N 718, H04N 314

Patent

active

047869658

ABSTRACT:
An electronic endoscope, equipped with an imaging apparatus having side bonding pads, is provided with a flexible insertable part which is formed to be small in diameter. Within a tip of the insertable part, a solid state imaging device is formed and a solid state imaging chip is provided with chip side bonding pads. The solid state imaging chip is secured to a base provided with base side bonding pads in groups. The chip side bonding pads and base side bonding pads are connected respectively with each other through bonding wires. The chip side bonding pads are provided on one side of the image area in a plurality of rows.

REFERENCES:
patent: 4442456 (1984-04-01), Uwata et al.
patent: 4477828 (1984-10-01), Scherer
patent: 4491865 (1985-01-01), Danna et al.
patent: 4573450 (1986-03-01), Arakawa
patent: 4594613 (1986-06-01), Shinbori et al.
patent: 4622954 (1986-11-01), Arakawa et al.
patent: 4677471 (1987-06-01), Takamura et al.
patent: 4682219 (1987-07-01), Arakawa
patent: 4706654 (1987-11-01), Giu et al.

Affiliated with

Also associated with

Rating

Eletronic endoscope with an imaging device having side bonding p does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Eletronic endoscope with an imaging device having side bonding p, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Eletronic endoscope with an imaging device having side bonding p will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-438592