Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1994-12-15
1996-03-05
Skane, Christine
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252 73, 252572, C10M17100, C10M16904
Patent
active
054964849
ABSTRACT:
Disclosed herein is an electroviscous fluid comprising an electrical insulating liquid and particles dispersed therein, said particles being composed of semiconducting particles having a weight average particle size of 1 to 100 .mu.m and dielectric particles having a weight average particle size of 1 to 3 .mu.m, the weight average particle size of the dielectric particles being not more than 30% of that of the semiconducting particles, the amount of the dielectric particles being 5 to 40 vol % based on the total particles, and the amount of the particles in the whole fluid being 10 to 60 vol %.
REFERENCES:
patent: 4687589 (1987-08-01), Block et al.
T. Sasada et al: Proc. 17th Japan Cong. Mater. Res., 228 Mar. 1974.
Patent Abstracts of Japan vol. 16, No. 54 (C-909) (5097) Feb. 1992, Japanese Patent 3-255196.
Chida Yukio
Shima Koji
Watanabe Kenji
Yamamoto Iwao
Mitsubishi Chemical Corporation
Skane Christine
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