Compositions – Electrically conductive or emissive compositions
Patent
1998-04-10
2000-05-09
Kopec, Mark
Compositions
Electrically conductive or emissive compositions
428461, 428518, H01B 100, B32B 1508
Patent
active
060599987
ABSTRACT:
A process for the preparation of a static dissipative material from a substrate material formed of a thermoformable polymeric matrix of low electrical conductivity. The substrate material is contacted with a solution of an aniline-based monomeric or oligomeric conductant which is selected from the group consisting of aniline and substituted aniline components. The aniline-based conductant is dissolved in a solvent and maintained in contact with the substrate material for a period of time to permit at least partial infusion of the conductant into the polymeric matrix. Subsequent to the contact step, the substrate material is subjected to a curing step in which the aniline-based segments introduced into the polymeric matrix are at least partially polymerized. The polymerization of the infused aniline segments can be carried out in an oxidizing environment or by subjecting the infused substrate material with electromagnetic radiation in the ultraviolet range. A static dissipative material comprises a substrate material, such as a flexible film as described above, having an aniline-based constituent material selected from the group of aniline and substituted aniline groups infused into the polymeric matrix. The aniline constituents are at least partially polymerized to provide a surface resistivity of no more than 1.times.10.sup.8 ohms/sq. Packaging of an electronic component, such as a circuit board integrated circuit, within a flexible film is prepared by contacting a heat-processable and shrinkable film formed of a thermoformable polymeric matrix with a solution of aniline-based monomeric or oligomeric conductant. The film product is then heated and allowed to cool to provide a shrink-wrapped electronic component.
REFERENCES:
patent: 4438251 (1984-03-01), Herweh
patent: 4604427 (1986-08-01), Roberts et al.
patent: 4711742 (1987-12-01), Jen et al.
patent: 4755326 (1988-07-01), Liepins et al.
patent: 4872910 (1989-10-01), Eshleman et al.
patent: 5320780 (1994-06-01), Unruh
patent: 5624605 (1997-04-01), Cao et al.
Lindsey Dana M.
Unruh Greg Roland
Hamlin Derrick G.
Jackson William D.
Kopec Mark
LandOfFree
Electrostatic dissipative substrate materials does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrostatic dissipative substrate materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrostatic dissipative substrate materials will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1061492