Electrostatic discharge protection in a semiconductor device

Electricity: electrical systems and devices – Safety and protection of systems and devices – Load shunting by fault responsive means

Reexamination Certificate

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C361S111000

Reexamination Certificate

active

10403570

ABSTRACT:
An electrostatic discharge (ESD) protection circuit for protecting a circuit from an ESD event, the ESD protection circuit comprises a metal-oxide semiconductor (MOS) device including a gate terminal, a first source/drain terminal, a second source/drain terminal and a bulk terminal, the bulk and first source/drain terminals being operatively coupled across the circuit to be protected, the gate and second source/drain terminals being coupled together; and a voltage generation circuit coupled between the bulk and gate terminals of the MOS device. The voltage generation circuit is configured to generate a voltage difference between the bulk and gate terminals of the MOS device during at least a portion of the ESD event. In this manner, a current handling capability of the MOS device is increased, thereby advantageously enabling a smaller sized device having a significantly smaller capacitance associated therewith to be employed in the ESD protection circuit.

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A.Z.H. Wang et al., “An On-Chip ESD Protection Circuit with Low Trigger Voltage in BiCMOS Technology,” IEEE Journal of Solid-State Circuits, vol. 36, No. 1, pp. 40-45, Jan. 2001.

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