Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2007-11-27
2007-11-27
Ngô, Ngân V. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S762000, C257S773000, C257SE23011
Reexamination Certificate
active
10876980
ABSTRACT:
An integrated circuit package includes a package substrate with a plurality of pins coupled to a semiconductor chip having a plurality of bond pads, some of which are ic bond pads coupled to an integrated circuit formed on the semiconductor chip and others of which are floating bond pads that are isolated from the integrated circuit. The plurality of pins include active pins coupled to active bond pads and dummy (non-coupled) pins coupled to floating bond pads. The floating bond pads are formed of interconnect materials also used to form the integrated circuit. BGA or flip-chip IC packages may be used and a method is provided for forming the IC package. The floating bond bad design prevents ESD (electrostatic discharge) from damaging the active device due to an adjacent non-coupled pin of the package being subjected to ESD.
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