Electrostatic chuck

Details Electrostatic chuck Electrostatic chuck

1992-03-26

1997-03-04

Edwards, Laura

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

156598, 361230, 361234, B32B 1800

Patent

active

056075413

ABSTRACT:
An improvement is proposed in an electrostatic chuck, which is used in holding and transporting, for example, a semiconductor silicon wafer under processing in the manufacture of electronic devices, having an internal electrode layer sandwiched between two dielectric layers of a ceramic material. The disadvantage caused by the inherent porosity of the ceramic material can be dissolved by the invention according to which the pores are filled with a thermally decomposable liquid compound of silicon, aluminum and the like and then the ceramic material is heated in an oxidizing atmosphere so as to decompose and oxidise the impregnant compound into the oxide formed in situ and filling the pores so that the electrostatic attractive force can be increased as a consequence of the increase in the effective dielectric constant along with high resistance against any corrosive gaseous atmosphere as compared with conventional pore-filling materials such as epoxy resins.

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