Electrostatic breakdown protection for a semiconductor device

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Amplitude control

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327314, 327327, 391 56, H03K 508

Patent

active

060723505

ABSTRACT:
A SUB wiring provided outside of a common discharge line formed on outer periphery of a chip in parallel to the latter. To the common discharge line, only voltage clamping elements and diode elements as electrostatic protection elements are connected. The common discharge line is in floating condition for rising withstanding voltage. On the other hand, to the SUB wiring, additional circuits, such as BBG circuit and so forth, consisting of transistors are connected to connect the latter to the substrate. With these two wirings, the width of the common discharge line can be made narrower to limit an increase of a chip area. By this, it is possible to improve resistance to electrostatic breakdown without increasing chip area.

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patent: 5731940 (1998-03-01), Minogue
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patent: 5875086 (1999-02-01), Narita

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