Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Patent
1994-09-12
1996-07-02
Bovernick, Rodney B.
Optical waveguides
With disengagable mechanical connector
Optical fiber to a nonfiber optical device connector
385 96, 385126, 385128, 385137, G02B 636
Patent
active
055331580
ABSTRACT:
An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180.degree.-500.degree. C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential.
REFERENCES:
patent: 4294602 (1981-10-01), Horne
patent: 4466696 (1984-08-01), Carney
patent: 4475790 (1984-10-01), Little
patent: 4867524 (1989-09-01), Courtney et al.
patent: 5163108 (1992-11-01), Armiento et al.
"Low Temterature Electrostatic Silicon-to-Silicon Seals Using Sputtered Borosilicate Glass", A. D. Brooks, et al., Journal of Electrochemical Society, vol. 119, No. 4, p. 545 - Apr. 1972.
"Bonding Techniques for Microsensors", W. H. Ko, et al., Elsevier Science Publishers B.V. , p. 41-61, - Jan. 1985.
"Utilization of Electroplating to Lock Fibers for Use in Optical Device Packaging", L. A. Reith, et al., Journal of Lightwave Technology, vol. 10, No. 7 - Jul. 1992.
"Low Energy Metal-Glass Bonding", P. B. NeNee, Communications, pp. 5396-5397 - Jan. 1969.
"Field Assisted Glass-Metal Sealing", Wallis, et al., Journal of Applied Physics, vol. 40, No. 10, pp. 3946-3949 - Sep. 1969.
Han Hongtao
Tan Songsheng
Bovernick Rodney B.
The Whitaker Corporation
Wise Robert E.
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