Electrostatic bonding of optical fibers to substrates

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

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385 96, 385126, 385128, 385137, G02B 636

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055331580

ABSTRACT:
An optical interconnect comprises a metallized optical fiber electrostatically bonded to a thin film of an alkali-containing glass which is itself bonded to a planar surface of a semiconductive or conductive substrate. Another optical interconnect comprises an optical fiber having a thin film of an alkali-containing glass deposited thereon, wherein the fiber is electrostatically bonded to a planar surface of a semiconductive or conductive substrate. A process of bonding an optical fiber to a semiconductive or conductive substrate includes contacting the fiber with the substrate, applying a DC potential to the fiber-substrate combination, slowly heating the combination to a maximum temperature between 180.degree.-500.degree. C., maintaining the combination at the maximum temperature for a few minutes, cooling the combination to room temperature, and removing the DC potential.

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