Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1991-09-16
1994-06-21
Skane, Christine
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252 427, 252572, 556113, 556135, 556150, C10M16904, C10M17100
Patent
active
053226348
ABSTRACT:
This invention is directed to an electrorheological fluid which comprises nonconductive particulate susceptible to ionic and electronic polarization dispersed in a nonconductive fluid. The nonconductive particulate are a phenoxy organometallic salt. This salt is the reaction product of an esentially stoichiometric amount of phenoxy salt soluble or dispersible in a liquid and a divalent metal salt. The phenoxy salt can be made by reacting diphenol material with active metal or active metal hydroxide.
REFERENCES:
patent: 2197833 (1940-04-01), Reiff
patent: 2197834 (1940-04-01), Reiff et al.
patent: 2402448 (1946-06-01), Richard
patent: 2480823 (1949-09-01), Morris et al.
patent: 2672445 (1954-03-01), Stewart et al.
patent: 2672447 (1954-03-01), Stewart et al.
patent: 2672448 (1954-03-01), Newnan et al.
patent: 2795552 (1957-06-01), Abbott et al.
patent: 2795553 (1957-06-01), Lowe
patent: 3779921 (1973-12-01), Patmore et al.
patent: 3839210 (1974-10-01), Beiswanger et al.
patent: 3952059 (1976-04-01), Nebzydoski et al.
patent: 4049563 (1977-09-01), Burrous
patent: 4622169 (1986-11-01), Rickle
patent: 4687589 (1987-08-01), Block et al.
Holubka Joseph W.
Li Chi
Ford Motor Company
May Roger L.
Melotik Lorraine S.
Skane Christine
LandOfFree
Electrorheological fluids comprising phenoxy organometallic salt does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrorheological fluids comprising phenoxy organometallic salt, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrorheological fluids comprising phenoxy organometallic salt will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2219116