Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With mechanical abrasion or grinding
Reexamination Certificate
2003-03-18
2009-08-25
Wilkins, III, Harry D (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic erosion of a workpiece for shape or surface...
With mechanical abrasion or grinding
C205S147000
Reexamination Certificate
active
07578923
ABSTRACT:
The present invention provides a process for electropolishing a conductive surface of a semiconductor wafer. During the process, a contact electrode in a contact solution contacts a contact region on surface of the conductive layer with the contact solution. Further, during the process a process electrode in a process solution contacts a process region on the conductive surface with the process solution while applying an electrical potential between the contact electrode and the process electrode to electropolish the surface of the conductive layer of the process region.
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Basol Bulent M.
Talieh Homayoun
Knobbe Martens Olson & Bear LLP
Novellus Systems Inc.
Wilkins, III Harry D
LandOfFree
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