Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...
Patent
1998-10-13
2000-05-02
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating electrolytic or nonelectrolytic coating after it is...
205157, 205223, 427250, 427355, 427331, 438584, 438692, 438697, 438758, 438618, C25D 552, C25D 548, C23C 1600, H01L 2120, H01L 21302
Patent
active
06056864&
ABSTRACT:
In-laid metal, e.g., copper or copper alloy, contacts and conductive routing patterns are formed in recesses in the surface of a substrate by a damascene-type process, comprising depositing a layer of an electrically conductive material filling the recesses and covering the substrate surface, reducing the thickness of the layer by a process providing a faster rate of layer removal than that obtained by chemical-mechanical polishing (CMP), and subjecting the remaining layer thickness to CMP processing to (a) substantially remove the remaining layer thickness and (b) render the exposed upper surface of the material filling the recesses substantially coplanar with the substrate surface, whereby increased manufacturing throughput, greater planarity, and reduced defects are obtained.
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Advanced Micro Devices , Inc.
Gorgos Kathryn
Wong Edna
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