Electropolishing copper film to enhance CMP throughput

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

205157, 205223, 427250, 427355, 427331, 438584, 438692, 438697, 438758, 438618, C25D 552, C25D 548, C23C 1600, H01L 2120, H01L 21302

Patent

active

06056864&

ABSTRACT:
In-laid metal, e.g., copper or copper alloy, contacts and conductive routing patterns are formed in recesses in the surface of a substrate by a damascene-type process, comprising depositing a layer of an electrically conductive material filling the recesses and covering the substrate surface, reducing the thickness of the layer by a process providing a faster rate of layer removal than that obtained by chemical-mechanical polishing (CMP), and subjecting the remaining layer thickness to CMP processing to (a) substantially remove the remaining layer thickness and (b) render the exposed upper surface of the material filling the recesses substantially coplanar with the substrate surface, whereby increased manufacturing throughput, greater planarity, and reduced defects are obtained.

REFERENCES:
patent: 4944836 (1990-07-01), Beyer et al.
patent: 5091339 (1992-02-01), Carey
patent: 5173442 (1992-12-01), Carey
patent: 5219787 (1993-06-01), Carey et al.
patent: 5354712 (1994-10-01), Ho et al.
patent: 5691571 (1997-11-01), Hirose et al.
patent: 5723387 (1998-03-01), Chen
patent: 5736457 (1998-04-01), Zhao
patent: 5811917 (1998-09-01), Sekinger et al.
patent: 5899738 (1999-05-01), Wu et al.
patent: 5955178 (1999-09-01), Orita et al.
patent: 5981879 (1999-11-01), Dimitrakopoulos et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electropolishing copper film to enhance CMP throughput does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electropolishing copper film to enhance CMP throughput, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electropolishing copper film to enhance CMP throughput will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1591392

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.