Electroplating wires with nickel at high-speed and a nickel fluo

Details Electroplating wires with nickel at high-speed and a nickel fluo Electroplating wires with nickel at high-speed and a nickel fluo

1989-11-06

1991-02-05

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 49, C25D 312, C25D 706

Patent

active

049902261

ABSTRACT:
A bath for electrodeposition of nickel onto a steel wire substrate from a nickel fluoborate solution. The bath is pumped to a substantial pressure in a specialized high speed, high current density continuous wire plating cell. The bath has a high concentration of nickel ions and a low pH and is operated at very high current densities and elevated temperatures to achieve a good quality nickel plate deposition at a rate far exceeding that of prior art baths. The invention particularly applies to the plating of nickel onto steel wire at current densities of up to 14,500 amps per square foot.

REFERENCES:
patent: 2648628 (1953-08-01), Brown
patent: 3661731 (1972-05-01), Schevey
W. A. Wesley et al., 36th Annual Proceed. AM. Electroplaters' Soc., Reprint, (1949).

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