Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal or alloy coating on...
Reexamination Certificate
2005-04-26
2005-04-26
Koehler, Robert R. (Department: 1775)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Depositing predominantly single metal or alloy coating on...
C205S143000, C205S157000, C205S261000, C205S291000, C428S687000, C428S935000
Reexamination Certificate
active
06884335
ABSTRACT:
A negative bias is applied to an integrated circuit wafer immersed in an electrolytic plating solution to generate a DC current. After about ten percent to sixty percent of the final layer thickness has formed in a first plating time, biasing is interrupted during short pauses during a second plating time to generate substantially zero DC current. The pauses are from about 2 milliseconds to 5 seconds long, and typically about 10 milliseconds to 500 milliseconds. Generally, about 2 pauses to 100 pauses are used, and typically about 3 pauses to 15 pauses. Generally, the DC current density during the second plating time is greater than the DC current density during the initial plating time. Typically, the integrated circuit wafer is rotated during electroplating. Preferably, the wafer is rotated at a slower rotation rate during the second plating time than during the first plating time.
REFERENCES:
patent: 5972192 (1999-10-01), Dubin et al.
patent: 6074544 (2000-06-01), Reid et al.
patent: 6261433 (2001-07-01), Landau
patent: 6344129 (2002-02-01), Rodbell et al.
patent: 6432821 (2002-08-01), Dubin et al.
patent: 6440289 (2002-08-01), Woo et al.
patent: 20010045360 (2001-11-01), Omasa
patent: 20020056645 (2002-05-01), Taylor et al.
patent: 20020066673 (2002-06-01), Rodbell et al.
Buckalew Bryan L.
Majid Tariq
Pollack Margolita M.
Reid Jonathan D.
Sukamto John H.
Koehler Robert R.
Novellus Systems Inc.
Swenson Thomas
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