Electroplating uniformity by diffuser design

Details Electroplating uniformity by diffuser design Electroplating uniformity by diffuser design

1998-12-04

2000-08-15

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating moving substrate

205122, 205123, 205133, C25D 504

Patent

active

061030856

ABSTRACT:
Workpieces, such as semiconductor wafers, are electroplated with improved thickness uniformity by providing a diffuser member intermediate the cathode and anode of a fountain-type electroplating apparatus. The diffuser or member has a pattern of openings specifically designed to prevent channeling and/or selective directing of electrolyte towards the workpiece. In one embodiment, the diffuser member comprises a spiral-shaped pattern of openings originating at the center of the diffuser member and extending to the periphery thereof.

REFERENCES:
patent: 4304641 (1981-12-01), Grandia et al.
patent: 5731678 (1998-03-01), Zila et al.
patent: 6001235 (1999-12-01), Arken et al.

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