Electroplating solution for forming Pb-Sn alloy bump electrodes

Details Electroplating solution for forming Pb-Sn alloy bump electrodes Electroplating solution for forming Pb-Sn alloy bump electrodes

1995-06-26

1997-07-29

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205254, 205259, 205260, 205299, 205302, 205304, C25D 360, C25D 356, C25D 334, C25D 332

Patent

active

056518730

ABSTRACT:
An electroplating solution (A), comprises an aqueous solution consisting essentially of lead phenolsulfonate: 1 to 250 g/liter in terms of Pb content; tin phenolsulfonate: 0.1 to 250 g/liter in terms of Sn content; phenolsulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene alkylamine: 1 to 50 g/liter; a 1-naphthaldehyde derivative: 0.001 to 1 g/liter; and an aldol sulfanilic acid derivative: 0.1 to 30 g/liter; or an aqueous solution (B) consisting essentially of lead methanesulfonate: 1 to 250 g/liter in terms of Pb content; tin methanesulfonate: 0.1 to 250 g/liter in terms of Sn content; methanesulfonic acid: 20 to 300 g/liter; polyoxyethylene polyoxypropylene alkylamine: 1 to 50 g/liter; and an aldol sulfanilic acid derivative: 0.1 to 30 g/liter. Each of the electroplating aqueous solutions (A) and (B) contains 50 ppb or less radioactive isotopes, whereby Pb-Sn alloy bump electrodes with improved uniformity in height and improved surface smoothness can be formed on a surface of a semiconductor wafer.

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Blanchard et al., Chemical Abstracts, 23928d, vol. 54 (no month, 1960).

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