Electroplating solution for alloys of gold with tin

Details Electroplating solution for alloys of gold with tin Electroplating solution for alloys of gold with tin

2007-10-09

2007-10-09

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

C205S251000, C205S253000

Reexamination Certificate

active

10847468

ABSTRACT:
The invention relates to an electroplating solution for providing a deposit of an alloy of gold and tin. This solution includes an aqueous solvent in which gold is present in the form of a solution soluble cyanide complex and tin is present in the form of a solution soluble organotin complex. 2,2′-dipyridyl is present as an additive that allows the codeposition of useful gold-tin alloy compositions at current densities lower than would be possible in its absence, given the concentrations of the individual metallic components in the solution. This additive is generally used at a concentration of 0.1 to 1 grams per liter for imparting significant enhancements in providing gold-tin alloy deposits.

REFERENCES:
patent: 4168214 (1979-09-01), Fletcher et al.
patent: 4470886 (1984-09-01), Duva et al.
patent: 4767507 (1988-08-01), Wilkinson
patent: 6245208 (2001-06-01), Ivey et al.
patent: 1 065 308 (1967-04-01), None
patent: 2002-180259 (2002-06-01), None
patent: 2002180259 (2002-06-01), None

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