Electroplating processes and equipment utilizing a foam electrol

Details Electroplating processes and equipment utilizing a foam electrol Electroplating processes and equipment utilizing a foam electrol

1981-03-06

1982-11-23

Tufariello, T.

Chemistry: electrical and wave energy

Processes and products

204237, 204277, C25D 508, C25D 1700

Patent

active

043604102

ABSTRACT:
Improved electroplating processes and equipment, in which an inert gas (21) is mixed with a liquid electrolyte (20) to form a foam (23) of the gas plus electrolyte, which foam is then circulated (arrows A) through an electroplating chamber (30) in which anodes (12) and cathode substrates (10) are mounted so as to plate a metal from the foam electrolyte onto the cathodic surfaces of the substrates. Preferably, the gas is nitrogen or argon and the electrolyte may be any of various conventional plating solutions, such as a potassium gold cyanide solution in a specific example of a gold-plating process described in detail. The foam process provides improvements in uniformity of the thickness of the plated metal and in the surface appearance.

REFERENCES:
patent: 1260830 (1918-03-01), Studt
patent: 3104221 (1963-09-01), Hill
patent: 3284327 (1966-11-01), Maeda
patent: 3483049 (1969-12-01), Grubbe
patent: 3669852 (1972-06-01), Winters
patent: 4152221 (1979-05-01), Schaedel
patent: 4208255 (1980-06-01), Stahl

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