Electroplating process of electroplating an elecrically...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S846000, C029S852000, C204S230600, C427S140000

Reexamination Certificate

active

07827680

ABSTRACT:
An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12seconds.

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“Structuring of Laminated CU-Polyimide Films Via Laser Ablation” IBM Technical Disclosure Bulletin, IBM Corp., Aug. 1994, p. 481, vol. 37, No. 8., New York, U.S.

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