Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2004-01-06
2010-11-09
Trinh, Minh (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C029S852000, C204S230600, C427S140000
Reexamination Certificate
active
07827680
ABSTRACT:
An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10-12seconds.
REFERENCES:
patent: 3276977 (1966-10-01), Willmund et al.
patent: 3322881 (1967-05-01), Schneble et al.
patent: 3350498 (1967-10-01), Leeds
patent: 3716462 (1973-02-01), Jensen
patent: 3929593 (1975-12-01), Sugiyama et al.
patent: 3977884 (1976-08-01), Gulla et al.
patent: 4248633 (1981-02-01), Heijnen et al.
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4324589 (1982-04-01), Gulla et al.
patent: 4482596 (1984-11-01), Gulla et al.
patent: 4528259 (1985-07-01), Sullivan
patent: 4642163 (1987-02-01), Greschner et al.
patent: 4643793 (1987-02-01), Nakaso et al.
patent: 4650691 (1987-03-01), Kinoshita et al.
patent: 4777078 (1988-10-01), Miyabayashi
patent: 4908242 (1990-03-01), Hughes et al.
patent: 5021296 (1991-06-01), Suzuki et al.
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5200271 (1993-04-01), Kosaka
patent: 5243142 (1993-09-01), Ishikawa et al.
patent: 5258094 (1993-11-01), Furui et al.
patent: 5306336 (1994-04-01), Martyak et al.
patent: 5419926 (1995-05-01), Soltys
patent: 5519177 (1996-05-01), Wang et al.
patent: 5699613 (1997-12-01), Chong et al.
patent: 5741575 (1998-04-01), Asai et al.
patent: 5780143 (1998-07-01), Shimamoto et al.
patent: 6019878 (2000-02-01), Nidola et al.
patent: 6132853 (2000-10-01), Noddin
patent: 6214445 (2001-04-01), Kanbe et al.
patent: 6217987 (2001-04-01), Ono et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6251502 (2001-06-01), Yasue et al.
patent: 6261671 (2001-07-01), Asai et al.
patent: 6762921 (2004-07-01), Asai et al.
patent: 6793796 (2004-09-01), Reid et al.
patent: 7405146 (2008-07-01), Ma
patent: 2004/0134682 (2004-07-01), En et al.
patent: 42 25 961 (1994-02-01), None
patent: 0727926 (1996-08-01), None
patent: 1 288 992 (1972-09-01), None
patent: 2 214 520 (1989-09-01), None
patent: 51-90475 (1976-08-01), None
patent: 57-116799 (1982-07-01), None
patent: 4-055555 (1988-05-01), None
patent: 63-158156 (1988-07-01), None
patent: 02030769 (1988-07-01), None
patent: 1-263278 (1989-10-01), None
patent: 2-22887 (1990-01-01), None
patent: 02-182390 (1990-07-01), None
patent: 2-188992 (1990-07-01), None
patent: 2-238691 (1990-09-01), None
patent: 3-3296 (1991-01-01), None
patent: 4-48099 (1992-02-01), None
patent: 4-174596 (1992-06-01), None
patent: 5-044099 (1993-02-01), None
patent: 5-148662 (1993-06-01), None
patent: 5-287583 (1993-11-01), None
patent: 06-21648 (1994-01-01), None
patent: 6-112649 (1994-04-01), None
patent: 06-132629 (1994-05-01), None
patent: 06164149 (1994-06-01), None
patent: 6-232555 (1994-08-01), None
patent: 06-275959 (1994-09-01), None
patent: 06302963 (1994-10-01), None
patent: 6-314883 (1994-11-01), None
patent: 7-58201 (1995-03-01), None
patent: 07106769 (1995-04-01), None
patent: 07-283538 (1995-10-01), None
patent: 07-283539 (1995-10-01), None
patent: 7-321456 (1995-12-01), None
patent: 7-336017 (1995-12-01), None
patent: 08153971 (1996-06-01), None
patent: 8-264372 (1996-10-01), None
patent: 8-319597 (1996-12-01), None
patent: 9-135077 (1997-05-01), None
patent: 09172261 (1997-06-01), None
patent: 9-199854 (1997-07-01), None
patent: 9-199855 (1997-07-01), None
patent: 09-083140 (1997-09-01), None
patent: 9-246730 (1997-09-01), None
patent: 09-275273 (1997-10-01), None
patent: 9-289375 (1997-11-01), None
patent: 09-321434 (1997-12-01), None
patent: 9-331155 (1997-12-01), None
patent: 10-4254 (1998-01-01), None
patent: 10-65340 (1998-03-01), None
patent: 10-107436 (1998-04-01), None
patent: 10-209604 (1998-08-01), None
patent: 10-242639 (1998-09-01), None
patent: 11-004069 (1999-01-01), None
“Structuring of Laminated CU-Polyimide Films Via Laser Ablation” IBM Technical Disclosure Bulletin, IBM Corp., Aug. 1994, p. 481, vol. 37, No. 8., New York, U.S.
En Honchin
Hirose Naohiro
Nakai Tohru
Noda Kouta
Oki Takeo
Ibiden Co. Ltd.
Sughrue & Mion, PLLC
Trinh Minh
LandOfFree
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