Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1992-01-23
1994-01-04
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
205157, 205186, 205224, 437192, 437245, C23C 2800, H01L 21288
Patent
active
052757153
ABSTRACT:
Highly conformal layers of either titanium, Ti, titanium nitride, TiN, or titanium oxide, TiO.sub.x, are formed on exposed surfaces of silicon substrates by first forming a very thin chemical vapor deposition (CVD) layer of either doped polysilicon or a chosen metallic silicide, such as titanium silicide, tungsten silicide, tantalum silicide, or molybdenum silicide on the exposed silicon surfaces and any masking material remaining thereon. Thereafter, the layered structure is transferred to an electroplating bath wherein a layer of titanium is plated on the surfaces of the metallic silicide film using either an aqueous electroplating solution, a non-aqueous solution or a molten salt solution. Then, the structure is transferred to either an anneal furnace or to a rapid thermal processor (RTP) and heated to a predetermined elevated temperature for a predetermined time in the presence of nitrogen, using either nitrogen gas, N.sub.2, or ammonia, NH.sub.3, to form a titanium nitride film and an underlying metal-silicon interface having a good contact resistance at the silicon substrate surface. Alternatively, titanium oxide, TiO.sub.x, films may be formed in an oxygen ambient as an excellent etch stop material, or the vias may be completely electroplated with titanium, Ti, and then annealed with no nitrogen or oxygen present in the anneal furnace or rapid thermal processor.
REFERENCES:
patent: 3953266 (1976-04-01), Takai
patent: 4011144 (1977-03-01), Bachman
patent: 4432839 (1984-02-01), Kline
Bethurum William J.
Leader William T.
Micro)n Technology, Inc.
Niebling John
LandOfFree
Electroplating process for enhancing the conformality of titaniu does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroplating process for enhancing the conformality of titaniu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating process for enhancing the conformality of titaniu will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-304386