Electroplating process and composition

Details Electroplating process and composition Electroplating process and composition

1996-04-01

2000-01-25

Stucker, Jeffrey

Colloid systems and wetting agents; subcombinations thereof; pro

Continuous liquid or supercritical phase: colloid systems;...

Aqueous continuous liquid phase and discontinuous phase...

516 9, 516 11, 516 71, 516 77, B01J 1300

Patent

active

060179678

ABSTRACT:
The invention relates to a metal sulfide dispersion used for electroplating nonconductors such as substrates used for the formation of a printed circuit board. A printed circuit board made using the dispersion could have metallized through-holes comprising electrodeposited copper on the walls of the holes with an adsorbed layer of metal sulfide particles between the circuit board base material and the copper on the walls of the through-holes. The metal sulfide is characterized by spherical particles having a mean diameter of less than 100 nanometers and a particle size distribution where less than 10 percent of the particles within the dispersion have a diameter twice that of the mean diameter of all particles within the dispersion.

REFERENCES:
patent: 4895739 (1990-01-01), Bladon
patent: 5171659 (1992-12-01), Tsaur et al.
patent: 5210013 (1993-05-01), Tsaur et al.
patent: 5276290 (1994-01-01), Bladon
patent: 5667662 (1997-09-01), Sonnenberg et al.
Stavek et al., Chem. Mater. 1992, 4, pp. 545-555.

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