Electroplating process and composition

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate

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205164, 205184, C25D 554

Patent

active

054157625

ABSTRACT:
A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

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patent: 5207888 (1993-05-01), Bladon
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Gottesfeld, et al., "The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards," J. Electrochem Soc., vol. 139, No. 1, Jan. 1992, pp. 14-15.

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