Electroplating process and composition

Details Electroplating process and composition Electroplating process and composition

1995-02-28

1996-06-18

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174262, 174257, 361751, H05K 109

Patent

active

055280005

ABSTRACT:
A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer.

REFERENCES:
patent: 5106473 (1992-04-01), Witlaw et al.
patent: 5183552 (1993-02-01), Bressel et al.
patent: 5194313 (1993-03-01), Hupe et al.
patent: 5300208 (1994-04-01), Angelopoulos et al.
patent: 5356511 (1994-10-01), Hossel et al.
patent: 5368717 (1994-11-01), Gottesfeld et al.
patent: 5403467 (1995-04-01), Jonas et al.
patent: 5427841 (1995-06-01), De Leeuw et al.

Affiliated with

Also associated with

Rating

Electroplating process and composition does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroplating process and composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroplating process and composition will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-224454