Electroplating process and composition

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate

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205163, 205166, 205183, 205920, 205118, 205125, 252500, C25D 502, C25D 556, C25D 700, H01B 100

Patent

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056676620

ABSTRACT:
A process for electroplating a nonconducting substrate comprising formation of a film of a conductive polymer on the surface of a nonconducting substrate and electrolytic deposition of metal thereover. The conductive film is formed by deposition of the conductive polymer onto said surface from an aqueous suspension of said polymer containing a polymeric stabilizer having repeating alkylene oxide groups and a hydrophilic--lipophilic balance of at least 10.

REFERENCES:
patent: 4526706 (1985-07-01), Upson et al.
patent: 5415762 (1995-05-01), Allardyce et al.
Gottsfeld et al., J. Electrochem. Soc., vol. 139, No. 1, Jan. 1992, pp. 14-15.

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