Electroplating process

Details Electroplating process Electroplating process

1996-08-20

1998-08-04

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming nonelectrolytic coating before depositing...

205125, 205159, 205162, 205163, 205164, 205165, 205166, C23C 2800, C25D 502, C25D 554, C25D 556

Patent

active

057888302

ABSTRACT:
A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium compound, and providing electroplating. The process is characterized by using an aqueous solution comprising 5 to 60 wt % of sulfuric acid, 3 to 35 wt % of hydrogen peroxide, 0.01 to 10 wt % of a phosphonic group-containing amine or a salt thereof, and, optionally, 0.1 to 10 wt % of an amine other than the phosphonic group-containing amine, as a microetching agent. This process can ensure highly reliable electroplating to inner walls of printing wiring board through-holes.

REFERENCES:
patent: 4378270 (1983-03-01), Brasch
patent: 4401509 (1983-08-01), Schellinger, Jr.
patent: 4964959 (1990-10-01), Nelsen et al.
patent: 5207888 (1993-05-01), Bladon
patent: 5547558 (1996-08-01), Sakamoto et al.

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