Electroplating process

Details Electroplating process Electroplating process

1989-06-07

1990-04-10

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

049157965

ABSTRACT:
A process and an apparatus for coating a printed circuit board in a horizontal position in a coating chamber by flooding the chamber while the printed circuit board is suspended horizontally in a coating chamber between at least two anodes with adjustable power applied to the anodes provides for a uniform coating of the board and the aperture therein.

REFERENCES:
patent: 3798136 (1974-03-01), Olsen

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