Electroplating process

Details Electroplating process Electroplating process

1995-06-12

1996-03-19

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205163, 205183, 252502, 252510, C25D 554

Patent

active

055001068

ABSTRACT:
A process for electroplating a substrate by coating the substrate with a porous coating of conductive particles having a reducing agent within its pores and electroplating over said coating. The reducing agent causes formation of an initial electroless metal deposit over the conductive particle coating thus enhancing its conductivity. The process is especially useful for the fabrication of printed circuit boards.

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patent: 5262041 (1993-11-01), Gulla
patent: 5269973 (1993-12-01), Takahashi et al.
patent: 5276290 (1994-01-01), Bladon
patent: 5421898 (1995-06-01), Stamp et al.

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