Electroplating process

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating contains embedded solid material

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Details

205118, 205125, 205183, 205210, 252502, C25D 1500, C25D 502, C23C 510, H01B 104

Patent

active

056835655

ABSTRACT:
A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.

REFERENCES:
patent: 2897409 (1959-10-01), Gitto
patent: 4619741 (1986-10-01), Minten et al.
patent: 4897164 (1990-01-01), Piano et al.
patent: 5389270 (1995-02-01), Thorn et al.

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