Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating contains embedded solid material
Patent
1995-06-09
1997-03-18
Gorgos, Kathryn L.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating contains embedded solid material
205118, 205125, 205183, 205210, 252502, C25D 1500, C25D 502, C23C 2800, H01B 104
Patent
active
056119054
ABSTRACT:
A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.
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Faul et al., "Electrochemical Etching of Conductor Plates in Closed Electrolyte Circuits", Werkst. Ihre Veredl., 1(2), 11-13, 1979.
Faul et al., "Process for Copper Etching in Printed Circuit Manufacture", Galvanotechnik, 65(9), 736-743, 1974.
Burress Jeffrey P.
Colangelo Carl J.
Couble Edward C.
Florio Steven M.
Kapeckas Mark J.
Goldberg Robert L.
Gorgos Kathryn L.
Shipley Company L.L.C.
Wong Edna
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