Electroplating process

Details Electroplating process Electroplating process

1987-12-14

1989-03-07

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 20, 204 30, C25D 502, C25D 556

Patent

active

048103330

ABSTRACT:
A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3533918 (1970-10-01), Smith

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