Electroplating process

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate

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Details

205184, 205187, 205163, C25D 554

Patent

active

054845181

ABSTRACT:
A process for electroplating a substrate by coating the substrate with a liquid dispersion of conductive particles selected from the group of metals, metal oxides and metal sulfides, drying the substrate and electroplating over said dried coating. The process is especially useful for the fabrication of printed circuit boards.

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patent: 4969979 (1990-11-01), Appelt et al.
patent: 5269973 (1993-12-01), Takahashi et al.
patent: 5276290 (1994-01-01), Bladon

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