Electroplating plant with opposed electrolitic cells and continu

Chemistry: electrical and wave energy – Apparatus – Electrolytic

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204237, 204269, 204275, 204224R, C25D 1728, C25D 2112

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active

054178282

ABSTRACT:
An electroplating plant for the electrolyte deposition of metals on flat components such as printed circuit boards and the like, oriented parallel to the direction of feed and continuously supplied via a system for the transmission and supply of cathode current to the boards. The apparatus has at least one pair of electrolytic cells. Each of the cells is provided with a feed aperture and the aperture for the outflow of the electrolytic solution supplied continuously by a pump drawing the same from a recovery tank. Each cell is provided with anodes and a passage for regulating the flow the electrolytic solution. Each cell has its outflow aperture located opposite that of another cell in order to provide an empty space through which the board passes; the board to be thus placed in contact with the electrolytic solution.

REFERENCES:
patent: 4401522 (1983-08-01), Buschow et al.
patent: 4402800 (1983-09-01), Ash et al.
patent: 4587000 (1986-05-01), Pellegrino et al.
patent: 4755271 (1988-07-01), Hosten
patent: 4761213 (1988-08-01), Hosten
patent: 4871435 (1989-10-01), Denofrio
Patent Abstracts Of Japan vol. 11, No. 365, Nov. 1987 and JP A 62 136 588, Jun. 1987.

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